Electronic Assembly, Test and Inspection Equipment

Nordson DAGE

Microelectronic and semiconductor bond test systems.
Wafer bump test systems.
High speed test systems to simulate impact testing.
3 and 4 point bend tester

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High resolution XRAY inspection systems for semiconductors and circuit boards.
Computer tomography (CAT) systems

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Nordson MARCH

Batch plasma cleaning and treatment systems
Inline plasma cleaning and treatment systems
Bench top reactive ion etch system

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